High heat dissipation board - メーカー・企業4社の製品一覧とランキング

High thermal conductivity substrate "Copper Inlay Substrate"

We provide a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper-inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

企業：三和電子サーキット
価格：Other

Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

Efficiently dissipate heat from the copper coin to the back side! It is possible to reduce the heat generation of the entire circuit board.

We would like to introduce our high thermal conductivity substrate, the "Copper Inlay Substrate [Copper Coin]." Among the diverse electronic components, there are some that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, we offer substrates embedded with copper coins. 【Features】 ■ Efficiently dissipates heat to the backside by incorporating copper coins ■ Reduces overall heat generation of the substrate *For more details, please refer to the PDF document or feel free to contact us.

企業：三和電子サーキット
価格：Other

Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

High Thermal Conductivity Substrate "Thick Copper Substrate"

Using thick copper foil of 105μm or more! We provide substrates that enhance large current and heat dissipation.

We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We offer substrates that enhance high current and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards - Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards - Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.

企業：三和電子サーキット
価格：Other

Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

High thermal conductivity substrate "Metal base substrate"

Used in products that require high heat dissipation, such as power boards and LED boards!

The "metal base substrate" is a high thermal conductivity substrate made by laminating aluminum or copper. By using metals with high thermal conductivity, it is possible to efficiently dissipate heat from heat-generating components. Additionally, by changing the resist ink from a standard white to a white suitable for LEDs, a high reflectivity is achieved. This enables the production of high-brightness LED substrates. 【Lineup】 ■ Copper base substrate ■ Aluminum base substrate ■ Double-sided aluminum base *For more details, please refer to the PDF document or feel free to contact us.

企業：三和電子サーキット
価格：Other

Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

High Heat Dissipation Substrate 'DPGA-M'

DPGA is made double-sided and supports back-side wiring! Equal-length wiring is possible even when parallel circuits are present.

"DPGA-M" is a high thermal conductivity substrate that features a single-sided multilayer design and supports backside wiring. By adopting a single-sided multilayer structure, it significantly enhances design flexibility, allowing for backside wiring. Although it has multiple layers stacked on one side, it is possible to penetrate copper bumps. This enables direct connection of high thermal conductivity components to the copper base and heat sink. 【Features】 ■ Single-sided multilayer structure ■ Enables backside wiring ■ Allows for equal-length wiring even in the presence of parallel circuits ■ Significantly increases design flexibility ■ Enables direct connection of high thermal conductivity components to the copper base and heat sink *For more details, please refer to the PDF document or feel free to contact us.

企業：ダイワ工業
価格：Other

Circuit board design and manufacturing
Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

High Heat Dissipation Substrate 'DPGA-S'

Separating the copper base on the back and ensuring insulation! Maintaining the strength of the substrate even after separating the copper base.

The "DPGA-S" is a high thermal conductivity substrate that separates the copper base on the back side and is designed for insulation. Thanks to the high thermal conductivity provided by the through-type copper bumps, it is possible to make the insulation layer up to 0.3mm thick. This allows for maintaining the strength of the substrate even after separating the copper base. Additionally, by separating the layers, it is also possible to mount electrodes on the copper base side. 【Features】 ■ High thermal conductivity due to through-type copper bumps ■ Insulation layer can be made up to 0.3mm thick ■ Allows for mounting electrodes on the copper base side by separating the layers ■ The back side can also be utilized for electrical connections *For more details, please refer to the PDF document or feel free to contact us.

企業：ダイワ工業
価格：Other

Circuit board design and manufacturing
Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Lightweight Conductor High Heat Dissipation Substrate "L&H Board"

Achieving lighter weight and higher heat dissipation! Lightweight conductor high heat dissipation substrate using aluminum.

The "L&H Board (Light body and high Heat radiation Board)" is a substrate that achieves lightweight and high heat dissipation by using aluminum. By employing metal conductors, direct soldering for component mounting is possible. It is suitable for applications such as high-brightness LED mounting substrates, automotive substrates (HCV/EV vehicle power substrates), high-current power substrates, various inverter substrates, high-frequency substrates, and solar power generation substrates. 【Features】 - Ensures strong adhesion through proprietary technology - Thickness of core aluminum material and surface aluminum material can be changed - Insulation layers can use both epoxy resin and special resin - Custom manufacturing available according to your needs For more details, please contact us or download the catalog.

企業：名東電産
価格：Other

Printed Circuit Board
Circuit board design and manufacturing

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

High Thermal Conductivity Substrate "Bending Aluminum Base Substrate"

The intended use is for automotive decorative accessories, etc.! A thin aluminum base substrate with a thickness of 0.40mm.

We would like to introduce our high thermal conductivity substrate, the "Bendable Aluminum Base Substrate." One of its features is that it has flexibility similar to that of a flexible circuit while being able to maintain a bent shape, which is a significant advantage. It also possesses heat dissipation properties as an aluminum base substrate. Please feel free to consult us when you need assistance. 【Features】 ■ Thickness: 0.40mm ■ Flexibility similar to that of a flexible circuit ■ Ability to maintain a bent shape ■ Also possesses heat dissipation properties *For more details, please refer to the PDF document or feel free to contact us.

企業：三和電子サーキット
価格：Other

Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

We meet advanced requirements through the combination of high-precision machining and high heat dissipation structures!

Our company handles the heat dissipation substrate "High Precision Heat Dissipation Via." The applicable substrate methods include general through-hole TH, BVH, IVH, and build-up methods. The finishing plating options include electroless NiAu, bonding NiAu, and other impedance control solutions. By combining high-precision machining with a high heat dissipation structure, we meet advanced requirements. 【Features】 ■ Applicable substrate methods: Compatible with general through-hole TH, BVH, IVH, and build-up methods ■ Finishing plating: Electroless NiAu, bonding NiAu 　　　　　　　　Other impedance control compatible ■ Resin dam structure compatible with both high and low standards *For more details, please refer to the PDF document or feel free to contact us.

企業：モリマーエスエスピー本社
価格：Other

Printed Circuit Board
Circuit board design and manufacturing

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

High heat dissipation board - メーカー・企業4社の製品一覧とランキング

High heat dissipation boardの製品一覧